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Nanoscale Res Lett. 2010; 5(4): 795.
Published online 2010 January 29. doi:  10.1007/s11671-010-9539-8
PMCID: PMC2893851

Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition

Erratum to: Nanoscale Res Lett (2009) 4:1481–1485 DOI 10.1007/s11671-009-9424-5

Unfortunately, the corresponding author name has been misspelled in the published version this paper[1].

Instead of Kaun-Jiuh Lin it should be Kuan-Jiuh Lin.

References

  • Ko Wen-Yin, Chen Wei-Hung, Cheng Cheng-Yuan, Lin Kuan-Jiuh. Architectural Growth of Cu Nanoparticles Through Electrodeposition. Nanoscale Research Letters. 2009;4(12):1481. doi: 10.1007/s11671-009-9424-5. [PMC free article] [PubMed] [Cross Ref]

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